Metal-insulator-metal capacitor structure

ABSTRACT

The disclosure is directed to semiconductor structures and, more particularly, to Metal-Insulator-Metal (MIM) capacitor structures and methods of manufacture. The method includes: forming at least one gate structure; removing material from the at least one gate structure to form a trench; depositing capacitor material within the trench and at an edge or outside of the trench; and forming a first contact in contact with a first conductive material of the capacitor material and a second contact in contact with a second conductive material of the capacitor material.

BACKGROUND

The invention relates to semiconductor structures and, moreparticularly, to Metal-Insulator-Metal (MIM) capacitor structures andmethods of manufacture.

Metal-insulator-metal (MIM) capacitors have been used extensively in thefabrication of integrated analog and mixed signal circuits onsemiconductor dies. A MIM capacitor typically includes a MIM capacitordielectric situated between lower and upper metal plates, which form theelectrodes of the MIM capacitor. MIM capacitors are fabricated onsemiconductor dies during back-end-of-line (BEOL) processing. Forexample, a conventional MIM capacitor can be fabricated, for example, byinserting a dielectric layer for a MIM capacitor dielectric and metallayers for lower and upper MIM capacitor electrodes in an unused“vertical” space available between interconnect metal layers on asemiconductor die during BEOL processing.

SUMMARY

In an aspect of the invention, a method includes: forming at least onegate structure; removing material from the at least one gate structureto form a trench; depositing capacitor material within the trench and atan edge or outside of the trench; and forming a first contact in contactwith a first conductive material of the capacitor material and a secondcontact in contact with a second conductive material of the capacitormaterial.

In an aspect of the invention, a method includes: forming a first gatestructure having a first width dimension; forming a second gatestructure having a second width dimension, larger than the first widthdimension; removing material from the second gate structure to form atrench; and forming a capacitor structure within the trench and partlyoutside of the trench.

In an aspect of the invention, a structure includes: a first gatestructure having a first width dimension; a second gate structure havinga second width dimension, larger than the first width dimension; and acapacitor structure having a portion formed within a trench formed byremoval of gate material of a second gate structure and partly outsideof the trench.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is described in the detailed description whichfollows, in reference to the noted plurality of drawings by way ofnon-limiting examples of exemplary embodiments of the present invention.

FIGS. 1-6 show structures and respective fabrication processes inaccordance with aspects of the invention.

FIGS. 7-9 show structures and respective fabrication processes inaccordance with additional aspects of the invention.

FIG. 10 shows a structure and respective fabrication processes inaccordance with further aspects of the invention.

FIG. 11 shows a structure and respective fabrication processes inaccordance with further aspects of the invention.

DETAILED DESCRIPTION

The invention relates to semiconductor structures and, moreparticularly, to Metal-Insulator-Metal (MIM) capacitor structures andmethods of manufacture. More specifically, the present invention isdirected to trench MIM capacitor structures inside a wide gatestructure. Advantageously, the MIM capacitor structures have improvedcapacitor contacts by recessing insulator material outside of the widegate structure. Also, in embodiments, the capacitor area can beincreased by including fins inside the wide gate structure. In thelatter configuration, the fin pitch is dimensioned so that pinch-off ofthe MIM stack does not result.

The MIM capacitor structures of the present invention can bemanufactured in a number of ways using a number of different tools. Ingeneral, though, the methodologies and tools are used to form structureswith dimensions in the micrometer and nanometer scale. Themethodologies, i.e., technologies, employed to manufacture the MIMcapacitor structures of the present invention have been adopted fromintegrated circuit (IC) technology. For example, the structures of thepresent invention are built on wafers and are realized in films ofmaterial patterned by photolithographic processes on the top of a wafer.In particular, the fabrication of the MIM capacitor structures of thepresent invention uses three basic building blocks: (i) deposition ofthin films of material on a substrate, (ii) applying a patterned mask ontop of the films by photolithographic imaging, and (iii) etching thefilms selectively to the mask.

FIG. 1 shows a structure and respective fabrication processes inaccordance with aspects of the invention. The structure 10 includes afirst gate structure 15 and a second gate structure 20, with the secondgate structure 20 is wider than the first gate structure 15. The gatestructures 15, 20 can be formed on an insulator layer 25 usingconventional replacement metal gate processes. The insulator layer 25can be an oxide layer formed on a substrate 30. The substrate 30 may becomposed of any suitable semiconductor material including, but notlimited to, Si, SiGe, SiGeC, SiC, GE alloys, GaAs, InAs, InP, and otherIII/V or II/VI compound semiconductors. In embodiments, the substratecan be silicon-on-insulator (SOI) technology.

In embodiments, the conventional replacement metal gate processescomprise, for example, depositing and patterning poly material on theinsulator layer 25. A nitride or low-k dielectric material 35 can beformed over the patterned poly material, and any exposed portions of theinsulator layer 25. In embodiments, the nitride or low-k dielectricmaterial 35 will encapsulate the gate structures 15, 20, and will formspacers or sidewalls on the gate structures 15, 20. An oxide or otherinsulator material 40 (e.g., interlevel dielectric material) can bedeposited on the nitride or low-k dielectric material 35 usingconventional deposition processes, e.g., chemical vapor deposition (CVD)processes, flowable oxide and high density plasma (HDP oxide andcombinations thereof. The oxide or other insulator material 40 can beplanarized to expose the poly material. The poly material is thenremoved and a high-k dielectric material, e.g., hafnium oxide, and gatestack material (e.g., metals with workfunction matching the desiredtransistor characteristics) is deposited within the trenches formed bythe removal of the poly material. The high-k dielectric material andgate stack material is represented by reference numeral 45. The high-kdielectric material and gate stack material 45 are then recessed usingconventional etching processes (e.g., reactive ion etching (RIE)). Acapping material 50 (e.g., nitride) is then deposited within the recessto form the gate structures 15, 20 of FIG. 1.

Still referring to FIG. 1, a capacitor mask 55 is formed over the gatestructure 15. In embodiments, the capacitor mask 55 can extend slightlybeyond an edge of the gate structure 15, onto the oxide or otherinsulator material 40. In embodiments, the capacitor mask 55 can be aresist or hardmask, which is patterned through conventional lithographicprocesses, e.g., exposure to energy (light).

In FIG. 2, selective etching processes are performed to remove materialsfrom the gate structure 20 in order to provide a trench 65. Inparticular, the capping material 50 and gate stack material are removedto form the trench 65. In embodiments, the capping material 50 andmaterials of the gate stack 15 are protected during this selectiveetching process by the capacitor mask. In embodiments, portions of thenitride material 35 are also recessed within the trench 65, as shown byreference numeral 65′. The selective etching processes will stop on thehigh-k dielectric material 45 of the gate structure 20. Once the etchingprocesses are completed, the capacitor mask can be removed byconventional stripping processes, e.g., ashing processes.

In FIG. 3, a bottom electrode material 70 (e.g., conductive electrodeplate) is deposited on the high-k dielectric material 45, and anyadditional exposed surfaces of the structure. The bottom electrodematerial 70 can be tungsten silicide or TiN, for example, deposited to athickness of about 5-10 nm; although other materials and dimensions arecontemplated by the present invention. For example, the bottom electrodematerial 70 can be polycrystalline or amorphous silicon, germanium,silicon germanium, a metal (e.g., tungsten, titanium, tantalum,ruthenium, zirconium, cobalt, copper, aluminum, lead, platinum, tin,silver, gold), a conducting metallic compound material (e.g., tantalumnitride, titanium nitride, tungsten silicide, tungsten nitride,ruthenium oxide, cobalt silicide, nickel silicide), carbon nanotube,conductive carbon, or any suitable combination of these materials. Theconductive material may further comprise dopants that are incorporatedduring or after deposition.

A high-k dielectric material 75 can be deposited on the bottom electrodematerial 70, using an atomic layer deposition (ALD) process. The high-kdielectric material 75 can be deposited to a thickness of about a fewnanometers; although other thicknesses are also contemplated by thepresent invention. Examples of high-k materials include but are notlimited to metal oxides such as hafnium oxide, hafnium silicon oxide,hafnium silicon oxynitride, lanthanum oxide, lanthanum aluminum oxide,zirconium oxide, zirconium silicon oxide, zirconium silicon oxynitride,tantalum oxide, titanium oxide, barium strontium titanium oxide, bariumtitanium oxide, strontium titanium oxide, yttrium oxide, aluminum oxide,lead scandium tantalum oxide, and lead zinc niobate. The high-k mayfurther include dopants such as lanthanum, aluminum. In alternateembodiments, the material 75 can be silicon oxide, silicon nitride,silicon oxynitride, boron nitride, high-k materials, or any combinationof these materials.

A top electrode material 80 (e.g., conductive electrode plate) isdeposited on the high-k dielectric material 75. The top electrodematerial 80 can be tungsten silicide or TiN, for example; although theuse of other materials are contemplated by the present invention asalready described herein. In embodiments, the top electrode material 80can be the same or different material as the bottom electrode material70.

In FIG. 4, an organic planarization layer 85 can be deposited on the topelectrode material 80, within the trench 65. After formation of theorganic planarization layer 85, an additional etching process isperformed to remove portions of the high-k dielectric material 75 andthe top electrode material 80, leaving a stepped feature 90′ within arecessed portion 90. In this way, the etching process will expose thetop electrode material 80, for later contact.

As further shown in FIG. 5, the organic planarization layer 85 can beremoved through a selective etching process, following by a depositionof a cap material 95. In embodiments, the cap material 95 can be anitride material or a low-k dielectric material, deposited usingconventional CVD or plasma enhanced atomic layer deposition (PEALD)processes to a same or similar thickness as the nitride or low-kdielectric material 35. An insulator material 100 is then deposited onthe cap material 95. The insulator material 100 can be an oxide materialdeposited using a conventional oxide fill process, e.g., CVD, HDP,flowable oxide and combinations thereof followed by a planarizationprocess.

In FIG. 6, an interlevel dielectric material 105 is deposited on theinsulator material 100. Contact trenches 110 are formed in the insulatormaterial 100, 105 and through other materials to land on and expose asurface of the top electrode material 80 and the bottom electrode 70,respectively. In embodiments, the bottom electrode material 70 iscontacted at an edge or outside of the gate structure 20, with the topelectrode material 80 contacted in a center of the gate structure 20.The trenches are then filled with metal material, e.g., TiN liner with atungsten fill, etc., followed by a planarization process (e.g., chemicalmechanical polishing (CMP)) to form contacts 115 in direct electricalcontact with the electrode materials 70, 80.

FIGS. 7-9 show structures and respective fabrication processes inaccordance with additional aspects of the invention. In this embodiment,a ledge is formed on the insulator material 40 in order to increasecontact area to the bottom electrode material. More specifically,similar to FIG. 1, the structure 10′ includes a first gate structure 15and a second gate structure 20, with the second gate structure 20 widerthan the first gate structure 15. The gate structures 15, 20 can beformed on an insulator layer 25 using conventional replacement metalgate processes and materials as described herein (e.g., high-kdielectric material and gate stack material 45, and a capping material50 (e.g., nitride)). The insulator layer 25 can be an oxide layer formedon the substrate 30. The substrate 30 may be composed of any suitablesemiconductor material including, but not limited to, Si, SiGe, SiGeC,SiC, GE alloys, GaAs, InAs, InP, and other III/V or II/VI compoundsemiconductors. In embodiments, the substrate can besilicon-on-insulator (SOI) technology.

A capacitor mask 55 is formed over the gate structure 15. Inembodiments, the capacitor mask 55 can be a resist or hardmask, whichcan extend slightly beyond an edge of the gate structure 15, onto theoxide or other insulator material 40. A selective etching step (e.g.,RIE) is performed to remove portions of the oxide or other insulatormaterial 40, adjacent to the gate structures 15, 20. This selectiveetching step forms a ledge or recessed surface area 40′, which willincrease the contact area for the bottom electrode material.

In FIG. 8, materials from the gate structure 20 are removed. Inparticular, the capping material 50 and gate stack material are removedto form a trench 65. In embodiments, the capping material 50 andmaterials of the gate stack 15 are protected during this selectiveetching process by the capacitor mask. In embodiments, portions of thenitride material 35 are also recessed within the trench 65, as shown byreference numeral 65′. The selective etching step will stop on thehigh-k dielectric material 45 of the gate structure 20. Once the etchingprocess is completed, the capacitor mask can be removed by conventionalstripping processes, e.g., ashing processes.

In FIG. 9, a bottom electrode material 70 is deposited on the high-kdielectric material 45, as well as on any exposed surfaces of thestructure including the ledge 40′. This formation of the bottomelectrode material 70 on the ledge 40′ increases the surface area of thebottom electrode material for improved contact with contacts 115′. Ahigh-k dielectric material 75 can be deposited on the bottom electrodematerial 70, using an atomic layer deposition (ALD) process; althoughother materials are also contemplated by the present invention asdescribed herein. A top electrode material 80 is deposited on the high-kdielectric material 75. In embodiments, the bottom electrode material 70and the top electrode material 80 can be tungsten silicide or TiN orother materials described herein, for example, deposited to a thicknessof about 5-10 nm. The high-k dielectric material 75 can be deposited toa thickness of about a few nanometers; although other thicknesses arealso contemplated by the present invention.

Still referring to FIG. 9, the bottom electrode material 70 is contactedat an edge or outside of the gate structure 20, with the top electrodematerial 80 contacted in a center of the gate structure 20. After apatterning process (e.g., removal of the top electrode material 80 atthe ledge portion 40′), a cap material 95 is formed on the exposedportions of the top electrode material 80. An insulator material 100 isthen deposited on the cap material 95. In embodiments, the cap material95 can be a nitride material or a low-k dielectric material, depositedusing conventional CVD or PEALD processes, to a same or similarthickness as the nitride or low-k dielectric material 35. The insulatormaterial 100 can be an oxide material deposited using a conventionaloxide fill process, e.g., CVD, HDP, flowable oxide or combinationsthereof, followed by a planarization process.

As further shown in FIG. 9, an interlevel dielectric material 105 isdeposited on the insulator material 100. Contact trenches 110, 110′ arethen formed in the insulator material 100, 105 and through othermaterials to land on and expose a surface of the top electrode material80 and the bottom electrode material 70. In embodiments, the two outercontact trenches 110′ will land on the ledge 40′, thus exposing theplanar surface of the bottom electrode material 70. The trenches arethen filled with metal material, e.g., TiN liner with a tungsten fill,etc., followed by a planarization process (e.g., chemical mechanicalpolishing (CMP)) to form the contacts 115, 115′ in direct electricalcontact with the electrode materials 70, 80. As shown in thisrepresentation, the contacts 115′ at the edge or outside of the gatestructure 20 are formed on an increased surface area of the bottomelectrode material 70 (due to the ledge 40′) and hence have improvedcontact to the bottom electrode material 70.

FIG. 10 shows a structure and respective fabrication processes inaccordance with additional aspects of the invention. More specifically,the structure 10″ of FIG. 10 can be aMetal-Insulator-Metal-Insulator-Metal (MIMIM) capacitor structure.Similar to FIG. 9, the structure 10″ includes a first gate structure 15and a second gate structure 20, with the second gate structure 20 widerthan the first gate structure 15. In this embodiment, the gatestructures 15, 20 are formed directly on substrate 30 in the manneralready described herein. The substrate 30 may be composed of anysuitable semiconductor material including, but not limited to, Si, SiGe,SiGeC, SiC, GE alloys, GaAs, InAs, InP, and other III/V or II/VIcompound semiconductors. In embodiments, the substrate can besilicon-on-insulator (SOI) technology.

The gate structures 15, 20 include an encapsulating nitride or low-kdielectric material 35, with high-k dielectric material and gate stackmaterial represented by reference numeral 45. A capping material 50(e.g., nitride) is deposited over the recessed portion of the gatematerial. A ledge or recessed surface area 40′ is formed by an etchingprocess as described herein. In this embodiment, removal of the gatematerial of the gate structure 20 includes the capping material, gatestack material and the high-k dielectric material, in order to exposethe underlying substrate 30. In embodiments, the capping material 50 andmaterials of the gate stack 15 are protected during this selectiveetching process by the capacitor mask.

In FIG. 10, a bottom electrode material 70 is deposited directly on thesubstrate 30 and the ledge 40′. By having the bottom electrode material70 deposited directly on the substrate 30, the substrate 30 (which canbe a fin in finFET technologies) can make an ohmic connection to thebottom electrode 70. A high-k dielectric material (or other materialdescribed herein) 75 can be deposited on the bottom electrode material70, using ALD processes. A center electrode material 80′ (e.g.,conductive electrode plate) is deposited (and patterned) on the high-kdielectric material 75, extending onto the ledge 40′. As previouslydescribed, the placement of the electrode material, e.g., centerelectrode material 80′, will increase the surface area for the contact115′. A high-k dielectric material 75′ is deposited on the centerelectrode material 80′, followed by the deposition of a top electrodematerial 80. In embodiments, the electrode materials 75, 80′ and 80 canbe the same or different material, e.g., tungsten silicide or TiN orother materials as described herein, for example, deposited to athickness of about 5-10 nm; although the use of other metals and metalalloys and dimensions are contemplated by the present invention. Thehigh-k dielectric material 75, 75′ can be deposited to a thickness ofabout a few nanometers; although other thicknesses are also contemplatedby the present invention.

Still referring to FIG. 10, a cap material 95 is formed on the exposedportions of the top electrode material 80. In embodiments, the capmaterial 95 can be a nitride material or a low-k dielectric material,deposited using conventional CVD or PEALD processes, to a same orsimilar thickness as the nitride or low-k dielectric material 35. Aninsulator material 100 is then deposited on the cap material 95. Theinsulator material 100 can be an oxide material deposited using aconventional oxide fill process, e.g., CVD, HDP and flowable andcombinations thereof, followed by a planarization process. An interleveldielectric material 105 is deposited on the insulator material 100, withcontact trenches 110, 110′ formed in the insulator material 100, 105 andthrough other materials to land on the respective top electrode material80 and the center electrode 80′. In embodiments, a contact trench canalso be formed as source/drain contacts to the substrate 30, outside ofthe capacitor region to complete the MIMIM capacitor structure.

In embodiments, the two outer contact trenches 110′ will land on theledge 40′, at the edge or outside of the gate structure 20 and thecontact trench will be formed in the center of the gate structure. Thecontact trenches 110, 110′ are then filled with metal material, e.g.,TiN liner with a tungsten fill, etc., followed by a planarizationprocess (e.g., chemical mechanical polishing (CMP)) to form the contacts115, 115′. As shown in this representation, the contacts 115′ formed atthe edge or outside of the gate structure 20 contacts an increasedsurface area and hence exhibit improved contact formation to the centerelectrode material 80′.

FIG. 11 shows a structure and respective fabrication processes inaccordance with additional aspects of the invention. More specifically,the structure 10′″ of FIG. 11 can be a MIMIM capacitor structure with anadditional contact outside of the gate area contacting a lowermostelectrode material. Similar to FIG. 10, the structure 10′″ of FIG. 11includes gate structures (with gate structure 20 shown), formed directlyon the substrate 30 which may be composed of any suitable semiconductormaterial including, but not limited to, Si, SiGe, SiGeC, SiC, GE alloys,GaAs, InAs, InP, and other III/V or II/VI compound semiconductors. Inembodiments, the substrate can be silicon-on-insulator (SOI) technology.An alternate option, substrate 30 is an insulator (similar to FIG. 1).In this option, the MIMIM would be formed on film 25 as shown in FIG. 1.

In this embodiment, a bottom electrode material 70 is deposited directlyon the substrate 30 and the planar surface of the insulator layer 40. Inalternative embodiments, the bottom electrode material 70 can also beformed on a ledge (e.g., ledge 40′) formed in the manner alreadydescribed. A high-k dielectric material (or other material describedherein) 75 can be deposited on the bottom electrode material 70, usingALD processes. A center electrode material 80′ is deposited on thehigh-k dielectric material 75, extending onto the planar surface of theinsulator layer 40 (or ledge 40′). The high-k dielectric material 75 andthe center electrode material 80′ can be patterned to expose the bottomelectrode material 70, at the edge or outside of the gate structure 20.A high-k dielectric material 75′ is deposited on the center electrodematerial 80′, followed by the deposition of a top electrode material 80.In embodiments, the electrode materials 70, 80′ and 80 can be the sameor different material, e.g., tungsten silicide or TiN or other materialsdescribed herein, deposited to a thickness of about 5-10 nm; althoughthe use of other metals and metal alloys and dimensions are contemplatedby the present invention. The high-k dielectric materials 75, 75′ can bedeposited to a thickness of about a few nanometers; although otherthicknesses are also contemplated by the present invention.

A cap material 95 is formed on the top surface of the structure, whichcan be patterned to expose portions of the center electrode material 80(and the bottom electrode material 70). An insulator material 100 isthen deposited on the cap material 95 and any remaining exposed portionsof the electrode material. In embodiments, the cap material 95 can be anitride material or a low-k dielectric material, deposited usingconventional CVD or PEALD processes, to a same or similar thickness asthe nitride or low-k dielectric material 35. The insulator material 100can be an oxide material deposited using a conventional oxide fillprocess, e.g., CVD, HDP, flowable oxide or combinations thereof,followed by a planarization process.

As further shown in FIG. 11, an interlevel dielectric material 105 isdeposited on the insulator material 100. Contact trenches 110, 110′,110″ are then formed in the insulator material 100, 105 and throughother materials to land on the top electrode material 80, the centerelectrode 80′ and the bottom electrode material 70, respectively. Inembodiments, the outer contact trenches 110′, 110″ will land on theplanar surface of the respective electrode materials 70, 80′. Thetrenches are then filled with metal material, e.g., TiN liner with atungsten fill, etc., followed by a planarization process (e.g., chemicalmechanical polishing (CMP)) to form the contacts 115, 115′, 115″ indirect electrical contact with the electrode materials. As shown in thisrepresentation, the contacts 115′, 115″ are formed at the edge oroutside of the gate structure 20 and have an increased contact surfacearea.

The method(s) as described above is used in the fabrication ofintegrated circuit chips. The resulting integrated circuit chips can bedistributed by the fabricator in raw wafer form (that is, as a singlewafer that has multiple unpackaged chips), as a bare die, or in apackaged form. In the latter case the chip is mounted in a single chippackage (such as a plastic carrier, with leads that are affixed to amotherboard or other higher level carrier) or in a multichip package(such as a ceramic carrier that has either or both surfaceinterconnections or buried interconnections). In any case the chip isthen integrated with other chips, discrete circuit elements, and/orother signal processing devices as part of either (a) an intermediateproduct, such as a motherboard, or (b) an end product. The end productcan be any product that includes integrated circuit chips, ranging fromtoys and other low-end applications to advanced computer products havinga display, a keyboard or other input device, and a central processor.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed:
 1. A structure, comprising: a first gate structurehaving a first width dimension; a second gate structure having a secondwidth dimension, larger than the first width dimension; and a capacitorstructure having a portion formed within a trench formed by removal ofgate material of a second gate structure and partly outside of thetrench.
 2. The structure of claim 1, wherein the capacitor structure isa metal-insulator-metal-insulator-metal structure.
 3. The structure ofclaim 1, wherein capacitor structure comprises: a first electrode plateon dielectric material within the trench; a dielectric layer on thefirst electrode plate within the trench; a second electrode plate on thedielectric layer within the trench and on insulator material formedoutside of the trench; a contact in direct electrical contact with thefirst electrode material within the trench; and contacts in directelectrical contact with the second electrode plate outside of thetrench.
 4. The structure of claim 3, wherein the second electrode plateis a top plate formed on a ledge of recessed insulator material outsideof the trench.
 5. The structure of claim 1, wherein the capacitorstructure comprises: a first electrode plate on within the; a dielectriclayer on the first electrode plate within the trench; a second electrodeplate on the dielectric layer and on insulator material outside of thetrench, a second dielectric layer on the second electrode plate; and athird electrode plate on the second dielectric layer, wherein: the firstelectrode plate is a bottom electrode plate formed within the trench;the second electrode plate is a center electrode plate formed within thetrench and outside of the trench; the third electrode plate is an upperelectrode plate formed within the trench; a first contact is formed indirect electrical contact with the upper electrode plate within thetrench; and a second contact is formed in direct electrical contact withthe center electrode plate outside of the trench.
 6. The structure ofclaim 5, wherein the dielectric material is a high-k dielectric materialof the second gate structure.
 7. The structure of claim 1, wherein thecapacitor structure comprises: a first electrode plate within the trenchby deposition and patterning processes; a dielectric layer on the firstelectrode plate within the trench by deposition and patterningprocesses; a second electrode plate on the dielectric layer and oninsulator material outside of the trench; a second dielectric layer onthe second electrode plate; and a third electrode plate on the seconddielectric layer, wherein: the first electrode plate is a bottomelectrode plate formed within the trench; the second electrode plate isa center electrode plate formed within the trench and outside of thetrench; the third electrode plate is an upper electrode plate formedwithin the trench; a first contact is in direct electrical contact withthe upper electrode plate within the trench; a second contact is indirect electrical contact with the center electrode plate outside of thetrench; and a third contact is in direct electrical contact with thebottom electrode plate outside of the trench.
 8. The structure of claim7, wherein the first electrode plate is formed directly on asemiconductor substrate.